Labor Condition Applications
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| Notice of the filing of a Labor Condition Application with the Employment Training Administration |
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H-1B nonimmigrant workers are being sought to work at
Intel Corporation or its subsidiaries Corporation through the filing of a Labor Condition Application with the Employment and Training Administration of the U.S. Department of Labor.
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Information concerning the number of workers within each Labor Condition Application, occupational classifications of the positions, wages offered, period of employment and work location can be found in the table below.
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All Labor Condition Applications are available for public inspection at the offices of Intel Corporation or its subsidiaries 2200 Mission College Boulevard, Santa Clara, California 95054, or for employers other than Intel Corporation or its subsidiaries , at the address indicated in the table below.
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Complaints alleging misrepresentation of material facts in the Labor Condition Application and/or failure to comply with the terms of the Labor Condition application may be filed with any office of the Wage and Hour Division of the United States Department of Labor.
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Command item
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| I-200-26034-615473 | 02/02/2026 | 02/21/2026 | Software Engineer
| 1 | Santa Clara, CA (Intel Site) and Newark, CA (Home Site) | 07/23/2026 | 07/22/2029 | $188,700.00 | $281,960.00 | |
| I-200-26027-592537 | 01/27/2026 | 02/15/2026 | Quality Reliability Engineer
| 1 | Chandler, AZ (Intel Site) and Gilbert, AZ (Home Site) | 07/18/2026 | 07/17/2029 | $133,050.00 | $187,840.00 | |
| I-200-26027-592306 | 01/27/2026 | 02/15/2026 | Firmware Engineer | 1 | Folsom, CA (Intel Site) | 07/26/2026 | 07/25/2029 | $126,420.00 | $178,480.00 | |
| I-200-26027-592417 | 01/27/2026 | 02/15/2026 | Graphics Hardware Engineer
| 1 | Folsom, CA(Intel Site) and Folsom, CA(Home Site) | 07/26/2026 | 07/25/2029 | $156,520.00 | $170,890.00 | |
| I-200-26027-592376 | 01/27/2026 | 02/15/2026 | Software Engineer | 1 | Hillsboro, OR (Intel Site) and Portland, OR (Home Site) | 07/26/2026 | 07/25/2029 | $127,878.00 | $169,980.00 | |
| I-200-26027-592531 | 01/27/2026 | 02/15/2026 | Component Design Engineer | 1 | Marietta, GA (Home Site) | 07/26/2026 | 07/25/2029 | $153,540.00 | $216,770.00 | |
| I-200-26027-592598 | 01/27/2026 | 02/15/2026 | Process Engineer
| 1 | Hillsboro, OR(Intel Site) and Beaverton, OR(Home Site) | 07/19/2026 | 07/18/2029 | $133,432.00 | $175,190.00 | |
| I-200-26028-596353 | 01/28/2026 | 02/16/2026 | Packaging Engineer
| 1 | Chandler, AZ (Intel Site) and Chandler, AZ (Home Site) | 07/19/2026 | 07/18/2029 | $115,290.00 | $162,760.00 | |
| I-200-26029-600008 | 01/29/2026 | 02/17/2026 | Component Design Engineer
| 1 | Austin, TX(Intel Site) and Austin, TX(Home Site) | 07/19/2026 | 07/18/2029 | $135,907.00 | $187,840.00 | |
| I-200-26029-600104 | 01/29/2026 | 02/17/2026 | Component Design Engineer | 1 | Austin, TX (Intel Site) and Austin, TX (Home Site) | 02/04/2026 | 02/03/2029 | $115,290.00 | $162,760.00 | |
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